Matt Kehoe began his career in electronics in 1981 as an original Proto Systems of Atlanta employee learning the printed circuit manufacturing process. His “sweet spot” was in the solder mask and silkscreen area, using his skills as a professional painter to put mask and inks on the circuit boards (and not on himself!) - very important later in his career. Matt then moved into sales as Western Regional Sales Manager for all accounts West of the Mississippi. Customers included Boeing Military Airplane Company (BMAC), Martin Marietta Aerospace, Ball Aerospace, as well as many other commercial and military companies.
In 1987 Matt co-founded Miltec Electronics where he designed, installed, and managed a pre-internet paperless purchasing systems for printed circuit boards called BearWare. (Bare Board Software = BearWare) This paperless purchasing system was pre-Internet using modems, dial up phone lines, and DOS-based programs. Companies and vendors traded Gerber files and order information over the modems, all prepackaged using the BearWare software platform. Cutting edge for its time!
Numerous national and international speaking engagements as well as data transfer workshops with the ICDA (International Circuit Designers Association) resulted in his introduction in 1989 to the SIPAD solid solder deposit (ssd) process invented by Siemens and DuPont in Germany. The process was designed to solve the challenges of the new surface mount components being introduced to the industry at a rapid pace. These components were very difficult to hand place in prototype quantities, but SIPAD facilitated this process flawlessly.
In 1996 Matt secured the sales and marketing rights for SIPAD ssd in the United States. He successfully imported the SIPAD solid solder deposit technology from Germany, as well as designing and managing the first solid solder deposit facility in the US from 1997 through 2001. Partnering with Midwest Printed Circuit Services(MPCS) and owner Joe Fesenfeld, Matt implemented the process in the US and successfully brought 36 new customers in 48 months exclusively through the SIPAD application process. (All that silk-screening experience sure came in handy!) MPCS Atlanta was the prototype demonstrating/proving that the process could be done successfully, efficiently, and very profitably.
On September 1, 2001, Matt opened SIPAD Systems Inc., the first and only independent, dedicated SIPAD solid solder deposit service bureau in the world. SIPAD Systems was uniquely positioned to provide coating services to OEM’s, CEM’s and ALL printed circuit manufacturers.
Ten days later 9/11 occurred, and while it had negative effects on his business there was enough demand to get through the crisis. The new facility had two complete SIPAD lines, a Tannlin T-8 laser and a complete stencil frame assembly operation - all located in the Alpharetta, GA.
Customers including Naval Avionics Weapons Systems, Goddard Space Flight Center, Kidde Aerospace, General Dynamics, and NASA at the Kennedy Space Center, as well as small to medium size companies, used the process to handle prototype quantities. SIPAD was a lifesaver for companies that did not have the resources to buy expensive equipment necessary for placement of surface mount components with either blind or very small leads. SIPAD was included in the IPC-7093 specification for bottom termination components as a reliable mounting structure. SIPAD Systems also offered laser cut stencils and printed circuit engineering.
Matt sold SIPAD Systems in 2013 after 16 years of ownership.
In 1987 Matt co-founded Miltec Electronics where he designed, installed, and managed a pre-internet paperless purchasing systems for printed circuit boards called BearWare. (Bare Board Software = BearWare) This paperless purchasing system was pre-Internet using modems, dial up phone lines, and DOS-based programs. Companies and vendors traded Gerber files and order information over the modems, all prepackaged using the BearWare software platform. Cutting edge for its time!
Numerous national and international speaking engagements as well as data transfer workshops with the ICDA (International Circuit Designers Association) resulted in his introduction in 1989 to the SIPAD solid solder deposit (ssd) process invented by Siemens and DuPont in Germany. The process was designed to solve the challenges of the new surface mount components being introduced to the industry at a rapid pace. These components were very difficult to hand place in prototype quantities, but SIPAD facilitated this process flawlessly.
In 1996 Matt secured the sales and marketing rights for SIPAD ssd in the United States. He successfully imported the SIPAD solid solder deposit technology from Germany, as well as designing and managing the first solid solder deposit facility in the US from 1997 through 2001. Partnering with Midwest Printed Circuit Services(MPCS) and owner Joe Fesenfeld, Matt implemented the process in the US and successfully brought 36 new customers in 48 months exclusively through the SIPAD application process. (All that silk-screening experience sure came in handy!) MPCS Atlanta was the prototype demonstrating/proving that the process could be done successfully, efficiently, and very profitably.
On September 1, 2001, Matt opened SIPAD Systems Inc., the first and only independent, dedicated SIPAD solid solder deposit service bureau in the world. SIPAD Systems was uniquely positioned to provide coating services to OEM’s, CEM’s and ALL printed circuit manufacturers.
Ten days later 9/11 occurred, and while it had negative effects on his business there was enough demand to get through the crisis. The new facility had two complete SIPAD lines, a Tannlin T-8 laser and a complete stencil frame assembly operation - all located in the Alpharetta, GA.
Customers including Naval Avionics Weapons Systems, Goddard Space Flight Center, Kidde Aerospace, General Dynamics, and NASA at the Kennedy Space Center, as well as small to medium size companies, used the process to handle prototype quantities. SIPAD was a lifesaver for companies that did not have the resources to buy expensive equipment necessary for placement of surface mount components with either blind or very small leads. SIPAD was included in the IPC-7093 specification for bottom termination components as a reliable mounting structure. SIPAD Systems also offered laser cut stencils and printed circuit engineering.
Matt sold SIPAD Systems in 2013 after 16 years of ownership.